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25th December 2021, 18:42
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ANSYS Electronics Suite 2022 R1 | 15.0 Gb
Product:ANSYS Electronics Suite
Version:2022 R1 with Documentation *
Supported Architectures:x64
Website Home Page :
www.ansys.com
Languages Supported:english
System Requirements:PC **
Size:15.0 Gb
The software developer Ansys is pleased to announce the availability of Ansys Electronics 2022 R1. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before.
Ansys Electronics 2022 R1 Release Notes
General Electronics Desktop
- Improved scripting API for property queries and edits
- Integration with Granta materials gateway
- Enhancements to fields calculator export
- Improved handling of post-processing variables in Optimetrics
- Enhanced zoom controls for 2D Descriptions
- Enhancements to Network Data Explorer
. Significant speedup when reading large Touchstone files
. Support for limit lines
. Scripting API (Beta)
- 3D Modeler link to Discovery geometry (Beta)
Granta Materials Data for Simulation
l PCB producer materials: Added 47 new records (Dk and Df curves only) and added supplemental properties for 72 existing Rogers records.
HFSS
- Auto Solver option for direct/iterative matrix solver
- Automation for creation of lumped ports
- Improved reliability of convergence for interpolating sweeps
- Improvements for SBR+
. Fast Frequency Looping to accelerate large, uniform frequency sweeps
. Enhanced useability and functionality for VRT filtering
. Rough surface model for Range-Doppler solutions
. Volumetric SBR+ support for combining materials and boundaries
. Radiated power calculations for linked or parametric antennas
. Visualization of conformance for current source antennas
. Visualization of far fields for imported Spherical Wave Expansion (SWE) antennas
- Mixed (model and terminal) ports in the Transient solution type
- Anisotropic materials in implicit Transient solver
- Conducting and dielectric IE region contact
- Improved Secondary Electron Emission (SEE) multipaction models
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- Support for HFSS 3D Layout components in HFSS 3D (Beta)
HFSS 3D Layout
- Enhancements to IC workflow capabilities and useability
- 3D component display and commands in the Project window
- Improved reliability of convergence for interpolating sweeps
- Support for matrix convergence
- Support for differential pair solutions in output variable convergence
- Addition of Volume Loss Density and 3D lines in fields post-processing
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- New broadband fast sweep based on model order reduction (Beta)
- New encrypted 3D Layout components (Beta)
SIwave
- New auto generation of HFSS regions in HFSS 3D Layout (Beta)
- Ability to include temperature-dependent materials for the AC solver
- Enhanced workflows and useability for DDRwizard (Beta)
- Support for multi-layer conductor analysis in Layer Stackup Wizard
- Enhancements to rules and reporting in EMI Scanner
- Enhancements for CPA
. Improved smart pin grouping
. Support for multiple die and PLOC/CPM
. New solution monitoring for the adaptive process
Maxwell
- Commercial release of AC Conduction solver with new features
. Multiphysics coupling
. Support for current excitations in matrix computations
- Multiphysics enhancements
. Inclusion of Litz wire loss in total/integrated loss
. New EM Loss coupling from Maxwell 2D to Icepak and Mechanical in AEDT
. Support for element-based coupling from 2D models with skew (Beta)
. Support for 3D impedance boundary losses
. Ability to export harmonic force to Ansys Mechanical
- Improved performance of expression cache for Transient with parametric distribution
- New resistive sheet in 3D Eddy
- Support Tau mesh in 2D band region
- Improved meshing for 3D models created by Motor-CAD
- Support for electric breakdown and inception voltage in fields post-processing
- Ability to push excitations from Twin Builder to 2D and 3D Transient
- Improved useability and performance of harmonic force calculation and workflows
- Removed most limitations on distributed skew model
- Ability to display motor and generator modes in one efficiency map
- Ability to create induction machine efficiency maps based on speed, slip, and voltage
- New 6-Phase/Poly-Phase ECE model
- Support for magnetization/demagnetization of nonlinear permanent magnets in A-Phi
- Ability to consider core loss effects on magnetic fields in A-Phi
Icepak
- New 2-way Chip Thermal Model workflow with RedHawk
- Ability to import IDX files
. New blower component
. Enhancements for PCB components
. New modeling options for drill holes, board cutouts, and device surfaces
- New ability to collapse/expand device definitions and hide filtered devices
- Support for wirebonds using plate model
- Improved meshing performance and robustness
- Enhancements to network schematic display and useability
- Improved efficiency of converting Classic Icepak projects
Mechanical
- New field summary reporting capability
- Ability to use expressions for temperature-dependent materials
- New slider capability for automatic mesh seeding (Beta)
- Enhancements for Structural solution type (Beta)
. New displacement load
. New pressure/force load
. New coupling to link temperature from Mechanical Thermal
. New coupling to link force from HFSS/Maxwell
Q3D Extractor
- New use of Tau mesh as default for 2D Extractor
- Automatic net detection and validation for AC-RL
- Ability to Description magnetic fields on surfaces for AC-RL
- Ability to export fields to Ensight
- New uniform current terminals for DC-RL
Circuit
Nexxim
- Support for multiple TDR probes
- Improved handling of DC passivity for IFPVLF
- Export PSPICE compatible model from Q3D RLGC Toolkit (Beta)
- Improved sampling of frequency points field solver co-simulation (Beta)
- Support for state-space models in SPISim
- Improved reporting of results from SPISim (Beta)
Ansys FilterSolutions
- Discrete filter optimization (Beta)
EMIT
- Ability to add CAD models and antenna passbands in the Coupling Editor
- Enhanced useability and performance of Results window
- Addition of 4-port and 5-port multiplexers
- Improved import of EMIT Classic projects and libraries
- New Spectrum Utilization Toolkit for visualizing spectrum usage and on-channel co-site
Twin Builder
Modelica Workflow Enhancements
= Support for conditional parameters and connector
= Enhancements for cloning uncompiled models
= Editor support for annotations and documentation
ROMs and ROM Viewer Enhancements
= New browser-based ROM viewer for web apps
= New solver in Dynamic ROM Builder
Export, Deployment, and Digital Twins
= Export Twin as web app
= Export deployable Hybrid Twin (Beta)
= Export Modal ROM from Mechanical
= Export SVD and Mode coefficients for LTI/LPV
= Support for Twin states save/restore through exported Python app
Library/Solver Enhancements
= Extended Linux support for C-models from the system library
= Support for Sparse Matrix format solver in SISO/MIMO toolkit
= State Saving (KRN) for Twin and FMU in Twin Builder
= Support for HPC licensing
= Excitation component (push to Maxwell)
= Improvements to library management
= Simulink co-simulation support for R2020b and R2021a
= Support for Hybrid calibration (Beta)
UI/UX Enhancements
= UI support for directory selector for ROM viz
= Min and max constraints in SRB and DRB
= Search filter for FMU import interface
= New dataset import and management dialog box for Modelica
Circuit
- 333593 Multiple TDR probes in a Circuit design now run independently without interfering with each other.
- 463137 Network Data Explorer now reads the gamma data written in touchstone files.
- 494846 Renaming links in Icepak network schematics no longer crashes Electronics Desktop.
EMIT
- 515609 Enhancements to GPS library models to better model the impact of Rx processing gain on broadband noise.
- 517651 The receiver mixer product model for specific LO injection settings includes a previously omitted, highest-order mixer product.
HFSS
- 506768 Correct Djordjevic models is now generated when bulk conductivity values are large.
- 509927 Delay time is now correct for TDR analysis in the implicit Transient solver.
- 532944 Report quantity MaxNearEPhi, MaxNearETheta, MaxNearEx, MaxNearEy, and MaxNearEz calculations are now correct.
Icepak
- 459253 Mesh operations for fan cutouts are now correctly applied.
- 471433 Trace mapping discrepancies for specific cases are resolved.
- 492300 Fields are now available after solve when 3D components are included.
- 515155 Calculated and imported EM losses now match when facet levels are increased.
Maxwell
- 461696 Consistent current density calculation among Electronics Desktop versions 2019 R2, 2020 R2, and 2021 R1.
SIwave
- 380446 Corrected interpretation of DC permittivity values stored in Electronics Desktop material libraries.
- 446116 Improved handling of DS materials when exporting HFSS or Q3D projects.
- 489794 Introduced user control of DC inductance computation during S-parameter simulation.
- 502105 Corrected issue with default CPA FEM CG solver producing non-converged results for large projects.
- 505774 Improved robustness of transmission line parameter calculations in the SIwave UI for stackups with conformal coats.
Twin Builder
- 471808 SDBCtrl no longer has a memory leak in ReadData API command.
https://i116.fastpic.org/big/2021/1225/8c/0b607bcefddfa34da5f4959c953ad08c.jpeg
The use ofAnsys Electronics solution suiteminimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products.
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
Ansys Sherlock
Ansys is the global leader in engineering simulation.By offering the best and broadest portfolio of engineering simulation software, we help solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A.
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ANSYS Electronics Suite 2022 R1 | 15.0 Gb
Product:ANSYS Electronics Suite
Version:2022 R1 with Documentation *
Supported Architectures:x64
Website Home Page :
www.ansys.com
Languages Supported:english
System Requirements:PC **
Size:15.0 Gb
The software developer Ansys is pleased to announce the availability of Ansys Electronics 2022 R1. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before.
Ansys Electronics 2022 R1 Release Notes
General Electronics Desktop
- Improved scripting API for property queries and edits
- Integration with Granta materials gateway
- Enhancements to fields calculator export
- Improved handling of post-processing variables in Optimetrics
- Enhanced zoom controls for 2D Descriptions
- Enhancements to Network Data Explorer
. Significant speedup when reading large Touchstone files
. Support for limit lines
. Scripting API (Beta)
- 3D Modeler link to Discovery geometry (Beta)
Granta Materials Data for Simulation
l PCB producer materials: Added 47 new records (Dk and Df curves only) and added supplemental properties for 72 existing Rogers records.
HFSS
- Auto Solver option for direct/iterative matrix solver
- Automation for creation of lumped ports
- Improved reliability of convergence for interpolating sweeps
- Improvements for SBR+
. Fast Frequency Looping to accelerate large, uniform frequency sweeps
. Enhanced useability and functionality for VRT filtering
. Rough surface model for Range-Doppler solutions
. Volumetric SBR+ support for combining materials and boundaries
. Radiated power calculations for linked or parametric antennas
. Visualization of conformance for current source antennas
. Visualization of far fields for imported Spherical Wave Expansion (SWE) antennas
- Mixed (model and terminal) ports in the Transient solution type
- Anisotropic materials in implicit Transient solver
- Conducting and dielectric IE region contact
- Improved Secondary Electron Emission (SEE) multipaction models
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- Support for HFSS 3D Layout components in HFSS 3D (Beta)
HFSS 3D Layout
- Enhancements to IC workflow capabilities and useability
- 3D component display and commands in the Project window
- Improved reliability of convergence for interpolating sweeps
- Support for matrix convergence
- Support for differential pair solutions in output variable convergence
- Addition of Volume Loss Density and 3D lines in fields post-processing
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- New broadband fast sweep based on model order reduction (Beta)
- New encrypted 3D Layout components (Beta)
SIwave
- New auto generation of HFSS regions in HFSS 3D Layout (Beta)
- Ability to include temperature-dependent materials for the AC solver
- Enhanced workflows and useability for DDRwizard (Beta)
- Support for multi-layer conductor analysis in Layer Stackup Wizard
- Enhancements to rules and reporting in EMI Scanner
- Enhancements for CPA
. Improved smart pin grouping
. Support for multiple die and PLOC/CPM
. New solution monitoring for the adaptive process
Maxwell
- Commercial release of AC Conduction solver with new features
. Multiphysics coupling
. Support for current excitations in matrix computations
- Multiphysics enhancements
. Inclusion of Litz wire loss in total/integrated loss
. New EM Loss coupling from Maxwell 2D to Icepak and Mechanical in AEDT
. Support for element-based coupling from 2D models with skew (Beta)
. Support for 3D impedance boundary losses
. Ability to export harmonic force to Ansys Mechanical
- Improved performance of expression cache for Transient with parametric distribution
- New resistive sheet in 3D Eddy
- Support Tau mesh in 2D band region
- Improved meshing for 3D models created by Motor-CAD
- Support for electric breakdown and inception voltage in fields post-processing
- Ability to push excitations from Twin Builder to 2D and 3D Transient
- Improved useability and performance of harmonic force calculation and workflows
- Removed most limitations on distributed skew model
- Ability to display motor and generator modes in one efficiency map
- Ability to create induction machine efficiency maps based on speed, slip, and voltage
- New 6-Phase/Poly-Phase ECE model
- Support for magnetization/demagnetization of nonlinear permanent magnets in A-Phi
- Ability to consider core loss effects on magnetic fields in A-Phi
Icepak
- New 2-way Chip Thermal Model workflow with RedHawk
- Ability to import IDX files
. New blower component
. Enhancements for PCB components
. New modeling options for drill holes, board cutouts, and device surfaces
- New ability to collapse/expand device definitions and hide filtered devices
- Support for wirebonds using plate model
- Improved meshing performance and robustness
- Enhancements to network schematic display and useability
- Improved efficiency of converting Classic Icepak projects
Mechanical
- New field summary reporting capability
- Ability to use expressions for temperature-dependent materials
- New slider capability for automatic mesh seeding (Beta)
- Enhancements for Structural solution type (Beta)
. New displacement load
. New pressure/force load
. New coupling to link temperature from Mechanical Thermal
. New coupling to link force from HFSS/Maxwell
Q3D Extractor
- New use of Tau mesh as default for 2D Extractor
- Automatic net detection and validation for AC-RL
- Ability to Description magnetic fields on surfaces for AC-RL
- Ability to export fields to Ensight
- New uniform current terminals for DC-RL
Circuit
Nexxim
- Support for multiple TDR probes
- Improved handling of DC passivity for IFPVLF
- Export PSPICE compatible model from Q3D RLGC Toolkit (Beta)
- Improved sampling of frequency points field solver co-simulation (Beta)
- Support for state-space models in SPISim
- Improved reporting of results from SPISim (Beta)
Ansys FilterSolutions
- Discrete filter optimization (Beta)
EMIT
- Ability to add CAD models and antenna passbands in the Coupling Editor
- Enhanced useability and performance of Results window
- Addition of 4-port and 5-port multiplexers
- Improved import of EMIT Classic projects and libraries
- New Spectrum Utilization Toolkit for visualizing spectrum usage and on-channel co-site
Twin Builder
Modelica Workflow Enhancements
= Support for conditional parameters and connector
= Enhancements for cloning uncompiled models
= Editor support for annotations and documentation
ROMs and ROM Viewer Enhancements
= New browser-based ROM viewer for web apps
= New solver in Dynamic ROM Builder
Export, Deployment, and Digital Twins
= Export Twin as web app
= Export deployable Hybrid Twin (Beta)
= Export Modal ROM from Mechanical
= Export SVD and Mode coefficients for LTI/LPV
= Support for Twin states save/restore through exported Python app
Library/Solver Enhancements
= Extended Linux support for C-models from the system library
= Support for Sparse Matrix format solver in SISO/MIMO toolkit
= State Saving (KRN) for Twin and FMU in Twin Builder
= Support for HPC licensing
= Excitation component (push to Maxwell)
= Improvements to library management
= Simulink co-simulation support for R2020b and R2021a
= Support for Hybrid calibration (Beta)
UI/UX Enhancements
= UI support for directory selector for ROM viz
= Min and max constraints in SRB and DRB
= Search filter for FMU import interface
= New dataset import and management dialog box for Modelica
Circuit
- 333593 Multiple TDR probes in a Circuit design now run independently without interfering with each other.
- 463137 Network Data Explorer now reads the gamma data written in touchstone files.
- 494846 Renaming links in Icepak network schematics no longer crashes Electronics Desktop.
EMIT
- 515609 Enhancements to GPS library models to better model the impact of Rx processing gain on broadband noise.
- 517651 The receiver mixer product model for specific LO injection settings includes a previously omitted, highest-order mixer product.
HFSS
- 506768 Correct Djordjevic models is now generated when bulk conductivity values are large.
- 509927 Delay time is now correct for TDR analysis in the implicit Transient solver.
- 532944 Report quantity MaxNearEPhi, MaxNearETheta, MaxNearEx, MaxNearEy, and MaxNearEz calculations are now correct.
Icepak
- 459253 Mesh operations for fan cutouts are now correctly applied.
- 471433 Trace mapping discrepancies for specific cases are resolved.
- 492300 Fields are now available after solve when 3D components are included.
- 515155 Calculated and imported EM losses now match when facet levels are increased.
Maxwell
- 461696 Consistent current density calculation among Electronics Desktop versions 2019 R2, 2020 R2, and 2021 R1.
SIwave
- 380446 Corrected interpretation of DC permittivity values stored in Electronics Desktop material libraries.
- 446116 Improved handling of DS materials when exporting HFSS or Q3D projects.
- 489794 Introduced user control of DC inductance computation during S-parameter simulation.
- 502105 Corrected issue with default CPA FEM CG solver producing non-converged results for large projects.
- 505774 Improved robustness of transmission line parameter calculations in the SIwave UI for stackups with conformal coats.
Twin Builder
- 471808 SDBCtrl no longer has a memory leak in ReadData API command.
https://i116.fastpic.org/big/2021/1225/8c/0b607bcefddfa34da5f4959c953ad08c.jpeg
The use ofAnsys Electronics solution suiteminimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products.
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
Ansys Sherlock
Ansys is the global leader in engineering simulation.By offering the best and broadest portfolio of engineering simulation software, we help solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A.
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